Film Depositions/Coatings
- Thermal oxidation
- LPCVD poly/ amorphous Si (doped/ undoped), SiO2 (LTO/ HTO), SiN (stoichiometric/ low stress)
- PECVD a-Si, SiOx, SiN (temp < 350C)
- ALD Al2O3, TiO2
- PVD sputtered/ evaporated metals
- PVD reactively sputtered ceramics
(TiN, AlOx, AlN, SiOx, SiNx, etc.)
- Polymer spin/ spray coating
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Lithography
- G-line/ I-line/ DUV PR processes
- Biocompatible PR processes (Su-8, photosensitive polymers, etc.)
- Liftoff lithography (negative liftoff PR, bilayer processes, etc.)
- Contact/ Projection printing
- Small CD and High alignment accuracy
- Front-to-backside alignment
- Cross platform compatibility for DUV steppers
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Etching
- RIE/ ICP/ TCP dry etch (Si based films, metal, metal oxide/nitride, polymer, III-V)
- Ionmilling
- Dry XeF2 and VHF etching
- Si DRIE
- Wet chemical etching
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Metrology
- 3D laser scan (opaque surface scan)
- Interferometry/ ellipsometry
(transparent film thickness)
- Electrical measurements (four-point probe, IV measurement, etc.)
- SEM/EDS (topical and cross-sectional inspections, material identification)
- Stylus Profilometry
- X-ray Diffraction
- AFM
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Packaging
- Wafer dicing
- Wire bonding
- Wafer level bonding
- Flip-chip bonding
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