Film Depositions/Coatings
  • Thermal oxidation
  • LPCVD poly/ amorphous Si (doped/ undoped), SiO2 (LTO/ HTO), SiN (stoichiometric/ low stress)
  • PECVD a-Si, SiOx, SiN (temp < 350C)
  • ALD Al2O3, TiO2
  • PVD sputtered/ evaporated metals
  • PVD reactively sputtered ceramics
  • (TiN, AlOx, AlN, SiOx, SiNx, etc.)
  • Polymer spin/ spray coating


Lithography
  • G-line/ I-line/ DUV PR processes
  • Biocompatible PR processes (Su-8, photosensitive polymers, etc.)
  • Liftoff lithography (negative liftoff PR, bilayer processes, etc.)
  • Contact/ Projection printing
  • Small CD and High alignment accuracy
  • Front-to-backside alignment
  • Cross platform compatibility for DUV steppers

Etching
  • RIE/ ICP/ TCP dry etch (Si based films, metal, metal oxide/nitride, polymer, III-V)
  • Ionmilling
  • Dry XeF2 and VHF etching
  • Si DRIE
  • Wet chemical etching

Metrology
  • 3D laser scan (opaque surface scan)
  • Interferometry/ ellipsometry
  • (transparent film thickness)
  • Electrical measurements (four-point probe, IV measurement, etc.)
  • SEM/EDS (topical and cross-sectional inspections, material identification)
  • Stylus Profilometry
  • X-ray Diffraction
  • AFM


Packaging
  • Wafer dicing
  • Wire bonding
  • Wafer level bonding
  • Flip-chip bonding