Thermal oxidation

LPCVD poly/ amorphous Si (doped/ undoped), SiO2 (LTO/ HTO), SiN (stoichiometric/ low stress)

PECVD a-Si, SiOx, SiN (temp < 350C)

ALD Al2O3, TiO2

PVD sputtered/ evaporated metals

PVD reactively sputtered ceramics

(TiN, AlOx, AlN, SiOx, SiNx, etc.)

Polymer spin/ spray coating

G-line/ I-line/ DUV PR processes

Biocompatible PR processes (Su-8, photosensitive polymers, etc.)

Liftoff lithography (negative liftoff PR, bilayer processes, etc.)

Contact/ Projection printing

Small CD and High alignment accuracy

Front-to-backside alignment

Cross platform compatibility for DUV steppers

RIE/ ICP/ TCP dry etch (Si based films, metal, metal oxide/nitride, polymer, III-V)

Ionmilling

Dry XeF2 and VHF etching

Si DRIE

Wet chemical etching

3D laser scan (opaque surface scan)

Interferometry/ ellipsometry

(transparent film thickness)

Electrical measurements (four-point probe, IV measurement, etc.)

SEM/EDS (topical and cross-sectional inspections, material identification)

Stylus Profilometry

X-ray Diffraction

AFM

Wafer dicing

Wire bonding

Wafer level bonding

Flip-chip bonding